CSF 35 Carbon Fiber Thermal Pad | 35.0W/mK | TOUSEN​

The ​CSF 35 Carbon Fiber Thermal Pad​ delivers reliable ​enhanced conductivity​ performance with 35.0W/mK thermal transfer capability, positioning it as an ideal ​mid-range thermal management​ solution for various electronic applications. This ​carbon fiber thermal pad​ maintains the series' characteristic softness and compressibility while providing balanced performance for applications requiring substantial heat dissipation without the need for ultra-high conductivity. The material's optimized composition ensures efficient air displacement at component interfaces, significantly improving thermal conduction efficiency in diverse operating conditions.

Technical Performance and Application Versatility

The ​CSF 35 enhanced conductivity thermal pad​ demonstrates consistent performance across multiple applications including 5G infrastructure, power management systems, and computing hardware. With a thermal impedance of 0.09°C·in²/W at 20psi for 1mm thickness, this ​mid-range thermal management​ solution effectively bridges thermal gaps between heat-generating components and cooling systems. The pad's natural adhesion properties facilitate easy installation and repositioning, while its 10±5% compression ratio accommodates various assembly tolerances. Available in thicknesses from 0.3mm to 12.0mm, the ​CSF 35 carbon fiber thermal pad​ can be customized for specific requirements in control boards, memory modules, and power distribution systems. Maintaining operational stability from -50°C to 160°C with UL94 V-0 flame resistance certification, this ​enhanced conductivity​ material provides a dependable thermal solution for applications where balanced performance and cost-effectiveness are key considerations.