TSAD66-P High-Viscosity Thermal Paste | TOUSEN

The ​TSAD66-P High-Viscosity Thermal Paste​ is a specialized ​anti-slump thermal interface material​ formulated for applications requiring superior stability and reliable thermal performance. This high-performance ​thermal compound​ delivers consistent 4.0 W/m·K thermal conductivity while maintaining excellent structural integrity with its 480 Pa·s viscosity at 22°C. The ​high-viscosity thermal paste​ is engineered to prevent sagging and migration in vertical applications, ensuring long-term thermal stability with minimal oil separation (<0.01% at 200°C) and low evaporation loss (0.18% at 120°C).

​Technical Performance and Application Advantages

The ​TSAD66-P anti-slump TIM​ demonstrates exceptional reliability in demanding thermal management applications, including power supply units and automotive electronics. This ​long-term stability thermal compound​ achieves optimal thermal resistance of 0.07°C·cm²/W at 60 psi, providing efficient heat transfer for extended operational lifetimes. The material's high viscosity characteristics make it particularly suitable for applications where ​anti-slump​ properties are critical, such as in vertically mounted heat sinks or components subject to vibration. With volume resistivity of 1.8×10¹² Ω·cm and specific gravity of 2.6 g/cm³, this ​high-viscosity thermal paste​ maintains excellent electrical insulation while ensuring consistent thermal performance. The non-curing formulation guarantees ​long-term stability​ without degradation, making it ideal for CPUs, GPUs, and industrial electronics where sustained thermal management is essential.