TSAD83 PLUS Thermal Gap Filler | TOUSEN

The ​TSAD83 PLUS Thermal Gap Filler​ is an advanced ​easy-spread thermal paste​ specifically formulated for efficient thermal management in electronic applications. This high-performance ​non-curing thermal compound​ delivers reliable 5.2 W/m·K thermal conductivity with optimized thermal resistance of 0.05°C·cm²/W at 60 psi. The ​thermal gap filler​ features a specially engineered silicone-based composition that ensures smooth application and excellent surface coverage, making it an ideal ​easy-spread thermal paste​ for various manufacturing processes.

Technical Performance and Application Benefits

The ​TSAD83 PLUS non-curing thermal compound​ demonstrates outstanding stability with minimal oil separation (<0.01% at 200°C) and low evaporation loss (0.18% at 120°C). This versatile ​thermal gap filler​ maintains optimal viscosity (120 Pa·s at 22°C) for effortless spreading and excellent surface wetting characteristics. With volume resistivity of 1.8×10¹² Ω·cm and specific gravity of 2.6 g/cm³, this ​easy-spread thermal paste​ provides reliable electrical insulation while ensuring efficient heat transfer. The material's non-curing formulation guarantees long-term stability without hardening or degradation, making it suitable for CPUs, GPUs, power supply units, and automotive electronics applications. The ​TSAD83 PLUS thermal gap filler​ offers 720-day shelf life and complies with international standards, providing a dependable thermal management solution for applications requiring consistent performance and easy application.